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Hot-melt taping of leaded components
Hot-Melt Tape
For finished-component taping of aluminum electrolytic capacitors, diodes, LEDs and other electronic components, used with a paper-tape carrier.
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Series and specifications
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Hot-Melt Tape specifications and technical parameters
Features: low initial tack; adhesion develops upon heating.
Features: good holding force, lasting adhesion and solvent resistance.
| Product model | Substrate | Adhesive system | Standard dimensions | General properties | ||||||
|---|---|---|---|---|---|---|---|---|---|---|
| Material | Color | Thickness (mm) | Width (mm) | Length (m) | Pull-out force (B/mm) | Tensile strength (N/in) | Elongation (%) | Taping temperature (℃) | ||
| SY684 | Crepe paper | Yellow | Hot-melt adhesive | 0.17±0.01 | Optional | 500/3000 | 30↑ | 90 | 10 | 80–110 |
| SY6843 | Crepe paper | Yellow | Hot-melt adhesive | 0.17±0.01 | Optional | 500/3000 | 35↑ | 90 | 10 | 120–150 |
| SY6845 | Crepe paper | White | Hot-melt adhesive | 0.17±0.01 | Optional | 500/3000 | 35↑ | 95 | 10 | 120–150 |
- These data are for reference only and are not acceptance criteria.
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