NINCHICO · Material applications
Glass sleeves, leads and electrodes for glass-encapsulated diodes, together with tapes and paper tapes for taping finished components.
Diode lead wires and glass sleeves are matched to the package type. When selecting DO-series and other specifications, check the glass sleeve's inside and outside diameters and length together with the lead-tip dimensions.
Stepped electrodes and MELF glass sleeves together determine the fit. Use DL-35 (LL-34), DL-41 and MICROMELF specifications to verify each segment diameter and length.
Red/white tape and paper, and halogen-free flat-back tape, secure components and distinguish polarity. Confirm compatibility with the actual taping equipment, lead pitch and feed format.
Matching materials and components
Welded CP wire and Dumet wire structure
View specifications →
Through-hole diode glass packaging
View specifications →
Stepped electrodes for MELF packages
View specifications →
Components for MELF and MICROMELF packages
View specifications →
Hot-melt taping of leaded components
View specifications →
Backing paper for hot-melt taping
View specifications →
Polarity identification and component taping
View specifications →
Diode taping components
View specifications →Product matching and selection
Please provide: package model, glass sleeve inner/outer diameters and length, lead or electrode dimensions, fit tolerances, sealing process requirements, taping method and quantity.