Taping of leaded components
Hot-melt tape, taping tape and matching paper tape secure components. Confirm width, thickness, roll length and bonding method for axial or radial format, component spacing and equipment conditions.
NINCHICO · Material applications
Electronic Component Taping & Automated Packaging
Taping tapes, paper tapes, SMT cover tapes and interleaving materials for axial, radial and surface-mount components, linking production, transport and automated feeding.
SMD component carrier-tape sealing
SMT cover tape works with carrier-tape pockets to protect components during transport and feeding. Selection focuses on carrier-tape compatibility, peel force, surface resistance and sealing temperature.
Process interleaving & packaging protection
Tear tape is used in preliminary resistor taping; interleaving paper separates and supports packaged components. Select according to the process to reduce roll changes and subsequent detaping issues.
Matching materials and components
Products for this application
Halogen-Free High-Temperature Tape
Heat-resistant component taping tape
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Hot-Melt Tape
Hot-melt taping of leaded components
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Paper tape
Backing paper for hot-melt taping
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SMT cover tape
SMD component carrier-tape sealing
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Halogen-Free Flat-Back Tape
Polarity identification and component taping
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Red/white tape and paper
Diode taping components
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Adhesive taping tape
Secondary taping of resistors and components for automatic insertion
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Non-adhesive taping paper
For use with component taping tape
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Tear Tape & Interleaving Paper
Upstream taping and packaging interleaving
View specifications →Product matching and selection
Start with the process and specifications.
Please provide: component type, taping or carrier structure, tape width and roll length, base thickness, sealing temperature, peel force or antistatic requirements, equipment model and quantity.